In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board (PCB), i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase "DIP package" is non-redundant.

Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device(s), and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description (with bent leads at the sides.) A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.

The photograph at the upper right shows three DIP14 ICs. DIPs may be used for semiconductor integrated circuits (ICs, "chips"), like logic gates, analog circuits, and microprocessors, which is by far their most common use. They may also be used for other types of devices including arrays of discrete components such as resistors (often called resistor packs), arrays of miniature rocker or slide switches known as DIP switches, various LED arrays including segmented and bargraph displays and light bars, miniature rotary encoder switches, and electromechanical relays.

Integrated circuits and resistor arrays usually have bent leads (leads are one type of IC package connector; other types are pins, and more recently balls) which extend from the sides of the package and turn to point downward; the IC packages tend to be black, and DIP resistor networks tend to be dark yellow or white plastic. The other types of DIP components, particularly LED devices, usually have completely straight leads extending directly from the bottom/back of the package, which is usually molded plastic and can be any color. DIP plugs for ribbon cable, to connect to DIP sockets, have also been made (and can be found in some Apple II computers, as well as on some electronics test equipment used by technicians.) Dallas Semiconductor manufactured integrated DIP real-time clock (RTC) modules which contained an IC chip and a non-replaceable 10-year lithium battery.

Both of these were examples of devices with leads emerging from the bottom; the construction of the RTC modules was very similar to the LED displays described below, with epoxy in a plastic shell. The RTC modules are an example of a component that could not be easily converted to surface-mount, as their size and weight with the contained battery would push the limits of mechanical strength of surface solder pads, and the thicker leads of a DIP as compared to most SMT packages were probably necessary to mechanically support the battery. Dallas also sold the same RTC chips without a battery in standard side-lead DIP packages; both versions would physically fit the same DIP sockets.

Some older equipment (circa the 1970s) used DIP terminal blocks onto the top of which discrete components could be soldered; these blocks (typically DIP16 size) would then be plugged into sockets on circuit boards and could be easily removed and swapped out, or test equipment connected between them and their sockets, for repair or testing of the machines they were a part of. These saw use mainly in industrial, commercial, and prototype equipment, not consumer electronics.

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